Huawei Technologies unveiled its Mate 90 smartphone series on Thursday, relying on its proprietary operating system and redesigned chip architecture to improve hardware performance amid ongoing US restrictions on advanced semiconductor shipments, Reuters reported via Emirates 24|7. The new smartphone family succeeds the Mate 80 lineup released in November 2025.
Premium models, including the Mate 90 Pro Max, are powered by Huawei's Kirin 9050 Pro system-on-chip. The processor is manufactured using a design method Huawei terms "LogicFolding," which restructures wiring into a three-dimensional layout rather than a standard two-dimensional planar design to achieve denser, faster data processing, although the method requires more silicon wafers. Huawei did not disclose the manufacturing partner producing the Kirin 9050 Pro.
Speaking prior to the launch, Huawei consumer business chief Richard Yu stated that advanced semiconductor fabrication capacity remains very limited in China, noting that smartphone processors must share manufacturing lines with Huawei's Ascend artificial intelligence chips. Huawei rotating chairman Eric Xu previously indicated in Shanghai that supply for Ascend 950 AI chips has been unable to satisfy domestic demand due to capacity constraints. Yu added that Chinese advanced chip production continues to rely on deep ultraviolet (DUV) lithography equipment while domestic manufacturers work toward extreme ultraviolet (EUV) capabilities.
Rising component costs have added commercial headwinds, with Yu stating that escalating memory prices added an average of $200 to each handset's production costs. According to market intelligence firm International Data Corporation (IDC), total smartphone shipments in China declined 7% year-on-year from January to August, whereas Huawei's handset shipments grew by 13% over the same period.
Sources
- Emirates 24|7 · 2026-10-01
